Yun-Ting Wang

Title: Innovations of Yun-Ting Wang

Introduction

Yun-Ting Wang is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His work focuses on improving the performance and reliability of semiconductor devices.

Latest Patents

One of his latest patents involves warpage control of semiconductor die. This patent describes a semiconductor die that includes a semiconductor substrate, a dielectric layer over the substrate, and a metal structure within the dielectric layer. It features a first metal pad over the metal structure and a first oxide-based passivation layer above the pad. Additionally, a second oxide-based passivation layer is applied over the first layer, with the second layer having a hardness less than that of the first. Another related patent outlines a method for warpage control, which includes forming a bottom passivation layer on a dielectric layer, creating an opening to expose part of the dielectric layer, and forming a metal pad within that opening.

Career Highlights

Yun-Ting Wang has worked with Taiwan Semiconductor Manufacturing Company Limited, where he has contributed to various innovative projects. His expertise in semiconductor technology has positioned him as a valuable asset in the industry.

Collaborations

He has collaborated with notable coworkers such as Yi-An Lin and Ching-Chuan Chang, further enhancing his contributions to semiconductor innovations.

Conclusion

Yun-Ting Wang's work in semiconductor technology showcases his innovative spirit and dedication to advancing the field. His patents reflect a commitment to improving device performance and reliability, making him a noteworthy inventor in the industry.