Hwaseong-si, South Korea

Yun Hyeok Im

USPTO Granted Patents = 4 

Average Co-Inventor Count = 3.5

ph-index = 2

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2020-2023

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4 patents (USPTO):Explore Patents

Title: Yun Hyeok Im: Innovator in Semiconductor Technology

Introduction

Yun Hyeok Im, a skilled inventor based in Hwaseong-si, South Korea, has made significant contributions to the field of semiconductor technology. With a total of four patents to his name, Yun has focused on developing advanced semiconductor packages that enhance device performance.

Latest Patents

One of his latest innovations is a semiconductor package that includes an interposer layer with opposing surfaces, accommodating both a first and a second semiconductor chip. This configuration introduces a block copolymer film that contains distinct patterns, one of which incorporates graphite. Additionally, he has developed a semiconductor device package that comprises a first and second semiconductor package connected by an interposer. The first semiconductor chip extends into a designated hole in the interposer, enhancing electrical connectivity between the components.

Career Highlights

Yun Hyeok Im is affiliated with Samsung Electronics Co., Ltd., where he has demonstrated exceptional expertise in semiconductor design and packaging. His work has contributed to the company's reputation as a leader in technological innovation, particularly in the field of electronics.

Collaborations

Throughout his career, Yun has collaborated with notable colleagues such as Hee Seok Lee and Tae Woo Kang. These partnerships have fostered an environment of creativity and knowledge exchange, resulting in successful inventions that push the boundaries of existing technology.

Conclusion

Yun Hyeok Im stands out as an inventor whose work in semiconductor technology has far-reaching implications for the industry. His commitment to innovation, along with his collaborative efforts at Samsung Electronics Co., Ltd., continues to pave the way for advancements that will shape the future of electronics.

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