This inventor holds 1 USPTO granted patent. Top assignee: Taiwan Union Technology Corporation. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Yun Hsing Sung: Inventor of a Copper Clad Laminate
Introduction
Yun Hsing Sung is an inventor based in Zhubei, Taiwan. He is associated with Taiwan Union Technology Corporation and is named on 1 patent concerning copper clad laminates.
Latest Patents
Sung’s patent, “Copper Clad Laminate and Uses of the Same,” describes a laminate comprising a dielectric layer, an adhesive layer, and copper foil. The adhesive layer uses a non-perfluorinated resin and is positioned between the dielectric layer and the copper foil. The foil’s surface has a ten-point average roughness (Rz) below 0.5 μm and a phosphorus content of no more than 499 μg/dm². These specified material and surface properties define the laminate described in the patent.
Career Highlights
Sung’s listed invention focuses on materials and construction for copper clad laminates. His association with Taiwan Union Technology Corporation connects his patent work with a company active in the technology sector.
Collaborations
The available information identifies Taiwan Union Technology Corporation as Sung’s company affiliation. No additional collaborators are specified in the provided data.
Conclusion
Yun Hsing Sung’s patent documents a copper clad laminate design distinguished by its non-perfluorinated adhesive and defined copper-foil surface properties.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile