The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2026
Filed:
Jan. 16, 2024
Taiwan Union Technology Corporation, Zhubei City, TW;
Jui-Hsiang Tang, Zhubei City, TW;
Yun Hsing Sung, Zhubei City, TW;
TAIWAN UNION TECHNOLOGY CORPORATION, Zhubei City, TW;
Abstract
A copper clad laminate is provided. The copper clad laminate includes a dielectric layer; an adhesive layer, which is disposed on at least one side of the dielectric layer and formed of an adhesive material, wherein the adhesive material includes a non-perfluorinated resin; and a copper foil, wherein the copper foil has a first surface and is disposed on the other side of the adhesive layer opposite to the dielectric layer, and the copper foil is adhered to the adhesive layer with the first surface, wherein the first surface has a ten-point average roughness (Rz) of less than 0.5 μm, and the copper foil has a phosphorus content of no more than 499 μg/dmat the first surface.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile