Hsinchu, Taiwan

Yun Chi Yang

This inventor holds 1 USPTO granted patent. Top assignee: Macronix International Co., Ltd.. Active years: 2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yun Chi Yang. Retrieved from https://idiyas.com/inventor/yun-chi-yang-3rbptaxo

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 11(Granted Patents)


Company Filing History:


Years Active: 2010

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1 patent (USPTO):Explore Patents

Title: Innovations by Yun Chi Yang in Chemical Mechanical Polishing

Introduction

Yun Chi Yang is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of chemical mechanical polishing, a critical process in semiconductor manufacturing. His innovative methods have paved the way for advancements in the industry.

Latest Patents

Yun Chi Yang holds 1 patent for a chemical mechanical polishing process. This patent describes a method that includes forming a film on a wafer with at least one trench structure. The process involves polishing the film's surface with a polishing composition to create a first polished surface. Following this, the first polished surface is rinsed with a rinse composition to yield a rinsed surface. Finally, the rinsed surface is polished again using a second polishing composition to achieve a second polished surface.

Career Highlights

Yun Chi Yang is currently employed at Macronix International Co., Ltd. His work at this company has allowed him to apply his expertise in chemical mechanical polishing, contributing to the development of advanced semiconductor technologies.

Collaborations

Yun Chi Yang has collaborated with notable colleagues, including Yung Tal Hung and Chun Fu Chen. These collaborations have fostered a productive environment for innovation and research within the company.

Conclusion

Yun Chi Yang's contributions to the field of chemical mechanical polishing demonstrate his commitment to innovation in semiconductor manufacturing. His patent and collaborative efforts highlight the importance of teamwork in advancing technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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