Company Filing History:
Years Active: 2025
Title: Innovations of Yun Cheng
Introduction
Yun Cheng is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of circuit board technology. With a total of 2 patents, his work showcases innovative designs that enhance the functionality and efficiency of electronic devices.
Latest Patents
Yun Cheng's latest patents include a novel circuit board design. This circuit board features a substrate with a first surface, a second surface, and a side surface. An insulating structure is positioned above the first surface, while a pad structure is integrated within the insulating structure. The design includes an opening on the pad structure and a removal region that allows for precise manufacturing. The side wire extends from the pad structure to the second surface, ensuring effective connectivity.
Another significant patent is for a device substrate that comprises a circuit substrate, first and second side wirings, and a sealant structure. The first side wiring extends from the first surface to the second surface along the side surface of the circuit substrate. The sealant structure covers the first side wiring, providing protection and enhancing the durability of the device.
Career Highlights
Yun Cheng is currently employed at Auo Corporation, where he continues to innovate in the field of electronic components. His work has been instrumental in advancing circuit board technology, making him a valuable asset to his company.
Collaborations
Yun Cheng collaborates with Hsi-Hung Chen, contributing to various projects that aim to push the boundaries of electronic design and manufacturing.
Conclusion
Yun Cheng's contributions to circuit board technology through his patents reflect his dedication to innovation. His work at Auo Corporation and collaborations with fellow inventors highlight his role in advancing the field.