Auo Corporation

Yun Cheng

Hsi-Hung Chen

A circuit board includes a substrate, an insulating structure, a pad structure and a side wire. The substrate has a first surface, a second surface opposite to the first surface, and a side surface. The insulating structure is located above the first surface of the substrate. The pad structure is located in the insulating structure. The insulating structure includes an opening on the pad structure and a removal region between the pad structure and the side surface of the substrate. At least a portion of the insulating structure in the removal region is removed, and the horizontal distance between the removal region and the pad structure is H, 0<H≤10 micrometers. The side wire is filled into the opening of the insulating structure, and extends from the pad structure to the second surface of the substrate.

Circuit board

A device substrate, including a circuit substrate, a first side wiring, a sealant structure, and a second side wiring, is provided. The first side wiring extends from a first surface of the circuit substrate to a second surface of the circuit substrate along a side surface of the circuit substrate. The sealant structure is located above the first surface and covers the first side wiring on the first surface. The second side wiring extends from the sealant structure to the first side wiring located on the side surface and the second surface of the circuit substrate.

Growing community of inventors

Hsinchu, Taiwan

Yun Cheng