The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 24, 2025
Filed:
Dec. 23, 2022
Applicant:
Auo Corporation, Hsinchu, TW;
Inventors:
Assignee:
AUO Corporation, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H01L 25/16 (2023.01); H05K 1/18 (2006.01); H10H 20/857 (2025.01); H10K 59/80 (2023.01); H10K 59/82 (2023.01); H10K 59/90 (2023.01); H10K 59/10 (2023.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H10H 20/857 (2025.01); H10K 59/82 (2023.02); H10K 59/873 (2023.02); H10K 59/90 (2023.02); H05K 1/11 (2013.01); H05K 1/18 (2013.01); H10K 59/10 (2023.02);
Abstract
A device substrate, including a circuit substrate, a first side wiring, a sealant structure, and a second side wiring, is provided. The first side wiring extends from a first surface of the circuit substrate to a second surface of the circuit substrate along a side surface of the circuit substrate. The sealant structure is located above the first surface and covers the first side wiring on the first surface. The second side wiring extends from the sealant structure to the first side wiring located on the side surface and the second surface of the circuit substrate.