Hachioji, Japan

Yumi Oka

This inventor holds 1 USPTO granted patent. Top assignee: Threebond Co., Ltd.. Active years: 1994.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yumi Oka. Retrieved from https://idiyas.com/inventor/yumi-oka-cc5fp00o

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 12(Granted Patents)


Company Filing History:


Years Active: 1994

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1 patent (USPTO):Explore Patents

Title: Yumi Oka and a Self-Locking Agent for Fastening Devices.

Introduction

Yumi Oka is a woman inventor associated with Hachioji, Japan, and Threebond Co., Ltd. Her patent work includes a self-locking agent designed for fastening devices.

Latest Patents

Oka is credited with 1 patent, titled “Self-locking agent.” The invention describes a microencapsulated adhesive composition containing an epoxy compound with at least two epoxy groups, an aromatic diamine, and at least one selected additive, such as thiosalicylic acid, salicylic acid, benzoic anhydride, boron trifluoride, or a boron trifluoride complex. At least one of the epoxy compound and aromatic diamine is microencapsulated to keep the constituents apart. The patent describes the agent as offering thermal resistance and storage stability.

Career Highlights

Oka’s listed patent is associated with Threebond Co., Ltd. and addresses adhesive technology for fastening devices. The available information identifies her location as Hachioji, Japan.

Collaborations

Minami Hanada and Naoki Sato are listed as Oka’s coworkers. The provided information does not specify their roles in the patent or the nature of their collaboration.

Conclusion

Yumi Oka’s patent work at Threebond Co., Ltd. focuses on a microencapsulated self-locking adhesive intended to combine storage stability with thermal resistance.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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