Yumi Maruyama

Title: Yumi Maruyama: Innovator in Semiconductor Technology

Introduction

Yumi Maruyama is a prominent inventor based in Kariya, Japan. She has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. Her innovative work has paved the way for advancements in semiconductor devices and manufacturing methods.

Latest Patents

One of her latest patents is for a semiconductor device and method of manufacturing the same. This semiconductor device features a sensor unit that includes a sensing part and a semiconductor substrate. The substrate is bonded to the sensor unit through an insulation film, creating an air-tight sealed chamber between the two components. The design includes a boundary region and a bonding region, with the bonding region having a larger area than the boundary region, ensuring a secure connection.

Another notable patent is for a dicing method for semiconductor substrates. This method involves forming a reforming layer in the substrate by irradiating it with a laser beam. A groove is then created along a cutting line, and a force is applied to cut the substrate at the reforming layer. The groove is strategically placed near the reforming layer to facilitate the cutting process.

Career Highlights

Yumi Maruyama is currently employed at Denso Corporation, where she continues to innovate in semiconductor technology. Her work has been instrumental in enhancing the efficiency and effectiveness of semiconductor devices.

Collaborations

Throughout her career, Yumi has collaborated with notable colleagues, including Atsushi Komura and Muneo Tamura. These collaborations have further enriched her contributions to the field.

Conclusion

Yumi Maruyama stands out as a leading inventor in semiconductor technology, with her patents reflecting her commitment to innovation. Her work continues to influence the industry and inspire future advancements.