The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2011
Filed:
Nov. 16, 2006
Atsushi Komura, Kariya, JP;
Muneo Tamura, Nagoya, JP;
Kazuhiko Sugiura, Nagoya, JP;
Hirotsugu Funato, Nagoya, JP;
Yumi Maruyama, Kariya, JP;
Tetsuo Fujii, Toyohashi, JP;
Kenji Kohno, Gifu, JP;
Atsushi Komura, Kariya, JP;
Muneo Tamura, Nagoya, JP;
Kazuhiko Sugiura, Nagoya, JP;
Hirotsugu Funato, Nagoya, JP;
Yumi Maruyama, Kariya, JP;
Tetsuo Fujii, Toyohashi, JP;
Kenji Kohno, Gifu, JP;
DENSO CORPORATION, Kariya, JP;
Abstract
A method for dicing a semiconductor substrate includes: forming a reforming layer in the substrate by irradiating a laser beam on the substrate; forming a groove on the substrate along with a cutting line; and applying a force to the substrate in order to cutting the substrate at the reforming layer as a starting point of cutting. The groove has a predetermined depth so that the groove is disposed near the reforming layer, and the force provides a stress at the groove.