This inventor holds 1 USPTO granted patent. Top assignee: Mitsubishi Electric Corporation. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Yukihiro Morishita: Semiconductor Device Inventor
Introduction
Yukihiro Morishita is an inventor associated with Tokyo, Japan, and Mitsubishi Electric Corporation. His work includes a patent concerning semiconductor device construction and manufacturing.
Latest Patents
Morishita is named on 1 patent: “Semiconductor Device and Method of Manufacturing Semiconductor Device.” The invention describes a semiconductor device with an insulating substrate, an insulating layer, and a front-surface circuit pattern. A semiconductor element is soldered to a mount on the circuit pattern, and a groove is formed in a region that includes part of the mount.
Career Highlights
Morishita’s listed patent reflects work on semiconductor packaging and device manufacturing. The described groove is incorporated into the substrate’s circuit-pattern region around the semiconductor element’s mount.
Collaborations
Morishita is associated with Mitsubishi Electric Corporation. His listed coworker is Seiya Kuranaga.
Conclusion
Yukihiro Morishita’s patent documents a semiconductor-device design that combines an insulating substrate, a soldered semiconductor element, and a groove in the mounting region.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile