The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2026
Filed:
Aug. 15, 2022
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Seiya Kuranaga, Tokyo, JP;
Yukihiro Morishita, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10W 70/68 (2026.01); H10W 40/25 (2026.01); H10W 99/00 (2026.01);
U.S. Cl.
CPC ...
H10W 70/68 (2026.01); H10W 40/255 (2026.01); H10W 99/00 (2026.01);
Abstract
A semiconductor device includes an insulating substrate and a semiconductor element. The insulating substrate includes an insulating layer and a front surface circuit pattern disposed on a surface of the insulating layer. The semiconductor element is bonded to a mount of a surface of the front surface circuit pattern via solder. A groove is provided in a region including a portion of the mount.
Quick Actions:
Kuranaga, Seiya. (2026). Semiconductor device and method of manufacturing semiconductor device (U.S. Patent No. 12787828). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12787828
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile