Tokyo, Japan

Seiya Kuranaga

This inventor holds 1 USPTO granted patent. Top assignee: Mitsubishi Electric Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Seiya Kuranaga. Retrieved from https://idiyas.com/inventor/seiya-kuranaga

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Seiya Kuranaga: Semiconductor Device Inventor

Introduction

Seiya Kuranaga is an inventor based in Tokyo, Japan, whose work includes semiconductor device technology. He is associated with Mitsubishi Electric Corporation.

Latest Patents

Kuranaga is named on 1 patent: “Semiconductor device and method of manufacturing semiconductor device.” The invention describes a semiconductor device with an insulating substrate, an insulating layer, and a front-surface circuit pattern. A semiconductor element is soldered to a mount on the circuit pattern, and a groove is formed in a region that includes part of the mount.

Career Highlights

Kuranaga’s listed patent reflects work on semiconductor-device construction and manufacturing, including the design of the substrate, circuit pattern, and component mount.

Collaborations

Kuranaga is listed as a coworker of Yukihiro Morishita. Both are associated with Mitsubishi Electric Corporation.

Conclusion

Seiya Kuranaga’s patent focuses on semiconductor-device structure and manufacturing, highlighting his contribution to technology associated with Mitsubishi Electric Corporation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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