This inventor holds 1 USPTO granted patent. Top assignee: Kyocera Corporation. Active years: 2000.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2000
Title: Innovations of Yukihiro Hiramatsu in Multi-Layer Wiring Boards
Introduction
Yukihiro Hiramatsu is a notable inventor based in Kokubu, Japan. He has made significant contributions to the field of electronics, particularly in the development of multi-layer wiring boards. His innovative approach has led to advancements that enhance the reliability and efficiency of electronic components.
Latest Patents
Hiramatsu holds a patent for a "Process for producing a multi-layer wiring board." This invention involves a multilayer wiring board formed by laminating multiple circuit board units. Each unit includes an insulating board made of thermosetting resin and a wiring circuit layer on its surface. The design incorporates via hole conducting passages that connect the wiring circuit layers of adjacent units. This method ensures that the insulating board maintains a flat surface, which is crucial for mounting flip chips. Additionally, the insulating board and conducting passages are resistant to chemical infiltration, thereby preventing defects in the circuit and ensuring reliable connections. Hiramatsu's patent is a testament to his innovative spirit and technical expertise, with 1 patent to his name.
Career Highlights
Yukihiro Hiramatsu is associated with Kyocera Corporation, a leading company in the electronics industry. His work at Kyocera has allowed him to focus on developing advanced technologies that meet the growing demands of modern electronics. His contributions have played a vital role in enhancing the performance and reliability of electronic devices.
Collaborations
Hiramatsu has collaborated with talented colleagues such as Yuji Iino and Riichi Sasamori. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.
Conclusion
Yukihiro Hiramatsu's work in the field of multi-layer wiring boards exemplifies the impact of innovative thinking in technology. His patent reflects a commitment to improving electronic components, ensuring they meet the high standards required in today's market. His contributions continue to influence the industry positively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile