Hiroshima, Japan

Yukihiko Okada

This inventor holds 1 USPTO granted patent. Top assignee: Sho-Bond Corporation. Active years: 1999.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yukihiko Okada. Retrieved from https://idiyas.com/inventor/yukihiko-okada-8e17vmtl

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 1999

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1 patent (USPTO):Explore Patents

Title: Yukihiko Okada: Innovator in Adhesive Technology

Introduction

Yukihiko Okada is a notable inventor based in Hiroshima, Japan. He has made significant contributions to the field of adhesive technology. His innovative approach has led to the development of a unique adhesive injection apparatus.

Latest Patents

Yukihiko Okada holds 1 patent for his invention of an adhesive injection apparatus. This apparatus features an adhesive reservoir tube with a flange portion, a connection cap with a pressing portion, and a nozzle with a flange portion. The design ensures that the adhesive reservoir tube and the nozzle are securely connected, allowing for efficient adhesive application.

Career Highlights

Okada is associated with Sho-bond Corporation, where he has been able to apply his inventive skills in a practical setting. His work has contributed to advancements in adhesive technologies, enhancing the efficiency and effectiveness of adhesive applications in various industries.

Collaborations

Throughout his career, Yukihiko Okada has collaborated with talented individuals such as Masahiro Suzuki and Yoshihiko Miyoshi. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Yukihiko Okada's contributions to adhesive technology exemplify the impact of innovation in practical applications. His work continues to influence the industry and inspire future inventors.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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