Trademarks = 2

Forward Citations = 16

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18 inventors (with patents filed for the assignee):

Hirokazu Iizuka (1 out of 15 patents)

Yuichi Goda (1 out of 7 patents)

Yasuto Ishikawa (1 out of 3 patents)

4. Norimasa Mimura (1 out of 2 patents)

5. Yuichi Futaki (1 out of 2 patents)

6. Tsutomu Nakamura (1 out of 79 patents)

7. Akira Ueda (1 out of 3 patents)

8. Hideo Tateno (1 out of 1 patent)

9. Katsuyuki Miyasato (1 out of 1 patent)

10. Tatsuyuki Kamijo (1 out of 1 patent)

11. Yukihiko Okada (1 out of 1 patent)

12. Yoshihiko Miyoshi (1 out of 1 patent)

13. Masahiro Suzuki (1 out of 1 patent)

14. Jun Suzuki (1 out of 34 patents)

15. Hiroshi Takemura (1 out of 1 patent)

5 patents: Sort by Forward Citations

1. 12448741 - Seismic reinforcement device for bridge (2025-10-21),

2. 10227699 - Anode for preventing corrosion, and concrete structure corrosion prevention structure and corrosion prevention method employing same (2019-03-12),

3. 6183567 - Graffiti removing method (2001-02-06),

4. 5881899 - Adhesive injection apparatus (1999-03-16),

5. 5211505 - Expansion joint for bridge structure (1993-05-18),

Company Overview

Sho-bond Corporation is a leading provider of adhesive bonding solutions for industrial applications. With over 20 years of experience in the industry, we offer a wide range of innovative products that are used in various sectors including automotive, electronics, and construction. Our commitment to quality and customer satisfaction has helped us build a strong reputation in the market.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 6 2026

5 Patents

#237 in

#6,651 in Japan

JP

Sho-Bond Corporation

Forward Citations = 16

18 inventors:

Hirokazu Iizuka (1 out of 15 patents)

Yuichi Goda (1 out of 7 patents)

Yasuto Ishikawa (1 out of 3 patents)

4. Norimasa Mimura (1 out of 2 patents)

5. Yuichi Futaki (1 out of 2 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Sho-Bond Corporation. Retrieved from https://idiyas.com/company/sho-bond

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]