Company Filing History:
Years Active: 2019
Title: Innovations by Yuki Morita
Introduction
Yuki Morita is a notable inventor based in Munich, Germany. He has made significant contributions to the field of adhesive technology, particularly in the development of materials used for wafer protection. His innovative approach has led to the creation of two patents that showcase his expertise and creativity.
Latest Patents
Yuki Morita's latest patents include a "Base for Back Grind Tapes" and an "Adhesive Sheet for Wafer Protection." The first patent describes a substrate for back grind tape that features a substrate film with a Young's modulus of 600 MPa or more. It also includes a buffer layer made from a urethane-containing cured material, which has a peak temperature of tan δ of 60°C or lower. The second patent presents a pressure-sensitive adhesive sheet designed for wafer protection. This adhesive sheet comprises a base material, an intermediate layer, and a pressure-sensitive adhesive layer. The intermediate layer is formed from a composition containing a non-energy ray-curable acrylic polymer and an energy ray-curable acrylic polymer. This innovative adhesive sheet excels in interfacial adhesion and stability over time, making it highly effective for its intended application.
Career Highlights
Yuki Morita is currently employed at Lintec Corporation, where he continues to develop cutting-edge adhesive technologies. His work has garnered attention for its practical applications in the semiconductor industry, particularly in enhancing the performance and reliability of wafer protection materials.
Collaborations
Yuki collaborates with Sayaka Enoki, who is also involved in the development of innovative adhesive solutions. Their partnership exemplifies the collaborative spirit that drives advancements in technology.
Conclusion
Yuki Morita's contributions to adhesive technology through his patents demonstrate his commitment to innovation and excellence. His work not only advances the field but also provides practical solutions for the semiconductor industry.