The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 2019

Filed:

Apr. 10, 2015
Applicant:

Lintec Corporation, Itabashi-ku, JP;

Inventors:

Yuki Morita, Munich, DE;

Yosuke Saito, Yoshioka-machi, JP;

Shigeto Okuji, Koshigaya, JP;

Assignee:

LINTEC CORPORATION, Itabashi-ku, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); B32B 27/30 (2006.01); B32B 27/40 (2006.01); C09J 7/29 (2018.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); B32B 27/308 (2013.01); B32B 27/40 (2013.01); C09J 7/29 (2018.01); B32B 2307/54 (2013.01); B32B 2457/14 (2013.01); C09J 2201/622 (2013.01); C09J 2203/326 (2013.01); C09J 2433/00 (2013.01); C09J 2475/00 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01);
Abstract

A substrate for back grind tape of the present invention includes a substrate film having a Young's modulus of 600 MPa or more; and a buffer layer provided on one face of the substrate film, the buffer layer formed of a urethane-containing cured material and having a peak temperature of tan δ of 60° C. or lower.


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