Tokyo, Japan

Yuji Kondou

This inventor holds 1 USPTO granted patent. Top assignee: Nec Corporation. Active years: 1999.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yuji Kondou. Retrieved from https://idiyas.com/inventor/yuji-kondou

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 1999

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1 patent (USPTO):Explore Patents

Title: Yuji Kondou: Innovator in Semiconductor Technology

Introduction

Yuji Kondou is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of semiconductor technology. His innovative approach has led to the development of a unique method for securing semiconductor chips.

Latest Patents

Kondou holds a patent for a method of securing a semiconductor chip on a base plate. This patent describes a process where a semiconductor chip, such as a cold cathode, is mounted on a base plate using conventional solder or metallic eutectic material. The chip is then secured to the base plate with an inorganic adhesive that hardens at a lower temperature than the mounting temperature. This method ensures that the bonding strength remains intact even at higher temperatures. He has 1 patent to his name.

Career Highlights

Yuji Kondou is associated with NEC Corporation, a leading company in the technology sector. His work at NEC has allowed him to focus on advancing semiconductor technologies. His contributions have been instrumental in enhancing the reliability and performance of semiconductor devices.

Collaborations

Kondou has collaborated with Akihiro Yano, a fellow innovator in the field. Their partnership has fostered advancements in semiconductor applications and technologies.

Conclusion

Yuji Kondou's innovative methods in semiconductor technology have made a lasting impact on the industry. His patent reflects his commitment to improving the performance and reliability of semiconductor devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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