The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 1999
Filed:
Jan. 29, 1997
Applicant:
Inventors:
Yuji Kondou, Tokyo, JP;
Akihiro Yano, Tokyo, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
438118 ; 438106 ; 438119 ; 438123 ;
Abstract
A semiconductor chip such as a cold cathode is mounted on a base plate using a conventional solder or like metallic eutectic material or conductive paste, and then secured to the base plate using an inorganic adhesive or like material, which is capable of being hardened at a temperature lower than the mounting temperature, and the bonding strength of which is not deteriorated even at higher temperatures.
Quick Actions:
Kondou, Yuji. (1999). Method of securing a semiconductor chip on a base plate and structure (U.S. Patent No. 5923956). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5923956
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile