This inventor holds 1 USPTO granted patent. Top assignee: Other. Active years: 2001.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2001
Title: Yuichi Sato: Innovator in Alloy Foil Technology
Introduction: Yuichi Sato is a notable inventor based in Futtsu, Japan. He has made significant contributions to the field of materials science, particularly in the development of alloy foils for liquid-phase diffusion bonding. His innovative work has the potential to enhance bonding processes in various industrial applications.
Latest Patents: Yuichi Sato holds a patent for an "Alloy foil for liquid-phase diffusion bonding bondable in oxidizing atmosphere." This invention provides liquid phase diffusion bonding alloy foils capable of bonding in an oxidizing atmosphere. The foils ensure joints with a homogeneous structure and adequate tensile strength in air in a short period of time. The patent details the composition of Ni-based liquid phase diffusion bonding alloy foils, which include essential components such as diffusion elements B or P, Si, and V, with the remainder being substantially Ni and unavoidable impurities. The thickness of these foils ranges from 3 to 100 micrometers.
Career Highlights: Throughout his career, Yuichi Sato has focused on advancing the technology of alloy foils. His work has been recognized for its innovative approach to bonding materials, particularly in challenging environments. With a patent count of 1 patent, he has established himself as a key figure in his field.
Collaborations: Yuichi has collaborated with notable colleagues such as Yasushi Hasegawa and Eiji Tsuru. Their combined expertise has contributed to the success of various projects and innovations in the realm of materials science.
Conclusion: Yuichi Sato's contributions to alloy foil technology exemplify the importance of innovation in materials science. His patented work not only addresses specific industrial challenges but also paves the way for future advancements in bonding technologies.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile