The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 24, 2001
Filed:
Jan. 06, 1999
Yasushi Hasegawa, Futtsu City, Chiba, JP;
Eiji Tsuru, Futtsu City, Chiba, JP;
Yuichi Sato, Futtsu City, Chiba, JP;
Shigekatsu Ozaki, Futtsu City, Chiba, JP;
Other;
Abstract
The present invention provides liquid phase diffusion bonding alloy foils capable of bonding in an oxidizing atmosphere, which can ensure joints with a homogeneous structure and adequate tensile strength in air in a short period of time using various alloys or Fe-based materials as materials to be bonded; specifically, they are Ni-based liquid phase diffusion bonding alloy foils with compositions comprising as essential components in terms of atomic percent, the diffusion elements B or P at 1.0-20.0% or B and P each at 1.0-20.0%, and Si at 0.5 to ≦15% or 0.5 to <10% and V at 0.1-20.0%, with the remainder substantially Ni and unavoidable impurities, and having a thickness of 3-100 &mgr;m. If necessary, one or more types of Cr, Mn or Mo, Co, and/or one or more types of W, Nb and Ti may be selectively included as appropriate. Compositions with a substantially amorphous crystal structure are most effective.