Ibaraki, Japan

Yuichi Nakazato


Average Co-Inventor Count = 6.0

ph-index = 3

Forward Citations = 20(Granted Patents)


Location History:

  • Ibaraki, JP (1995 - 1996)
  • Ibaraki-ken, JP (1996)

Company Filing History:


Years Active: 1995-1996

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3 patents (USPTO):Explore Patents

Title: Yuichi Nakazato: Innovator in Wiring Board Technology

Introduction

Yuichi Nakazato is a prominent inventor based in Ibaraki, Japan. He has made significant contributions to the field of wiring board technology, holding a total of 3 patents. His work focuses on developing adhesives that enhance the performance and reliability of multiple wire wiring boards.

Latest Patents

Nakazato's latest patents include innovative processes for producing multiple wire wiring boards. One notable patent describes an adhesive that comprises (a) solid epoxy resin with a molecular weight of 5000 or more, (b) a polyfunctional epoxy resin with at least three epoxy groups, (c) an intramolecular epoxy modified polybutadiene with at least three epoxy groups, (d) a cationic photoinitiator, and (e) a tin compound in specific weight ratios. This adhesive is effective in producing wiring boards that exhibit excellent heat resistance and solvent resistance, ensuring that the adhesive layer is free of voids and prevents the shifting of insulated encapsulated wires.

Another patent focuses on a multiple wire adhesive for wiring boards, utilizing the same components as mentioned above. This innovation further solidifies Nakazato's expertise in creating reliable and efficient wiring solutions.

Career Highlights

Yuichi Nakazato is currently employed at Hitachi Chemical Company, Ltd., where he continues to push the boundaries of adhesive technology. His work has been instrumental in advancing the capabilities of wiring boards used in various electronic applications.

Collaborations

Throughout his career, Nakazato has collaborated with notable colleagues, including Shigeharu Arike and Yorio Iwasaki. These partnerships have contributed to the development of cutting-edge technologies in the field.

Conclusion

Yuichi Nakazato's innovative work in wiring board technology and adhesive development has made a significant impact in the industry. His patents reflect a commitment to enhancing the performance and reliability of electronic components.

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