Hitachi Chemical Company, Ltd.

Yuichi Nakazato

Kanji Murakami

Shigeharu Arike

Toshiro Okamura

Yorio Iwasaki

Eiichi Shinada

An adhesive comprising (a) solid epoxy resin having a molecular weight of 5000 or more, (b) a polyfunctional epoxy resin having at least three epoxy groups, (c) an intramolecular epoxy modified polybutadiene having at least three epoxy groups, (d) a cationic photoinitiator, and (e) a tin compound in special weight ratios, is effective for producing multiple wire wiring boards having good heat resistance, solvent resistance wherein the adhesive layer has no voids and prevents shift of insulated encapsulated wires.

Process for producing multiple wire wiring board

Multiple wire adhesive on a multiple wire wiring board

An adhesive comprising (a) solid epoxy resin having a molecular weight of 5000 or more, (b) a polyfunctional epoxy resin having at least three epoxy groups, (c) an intramolecular epoxy-modified polybutadiene having at least three epoxy groups, (d) a cationic photoinitiator, and (e) a tin compound in special weight ratios, is effective for producing multiple-wire wiring boards having good heat resistance, solvent resistance and wherein the adhesive layer has no voids and prevents shift of insulated encapsulated wires.

Adhesive of epoxy resins, epoxy-modified polybutadiene and photoinitiator

Growing community of inventors

Ibaraki, Japan

Yuichi Nakazato