Yuhao Bi

Title: Innovations of Yuhao Bi in Substrate Bonding Technology.

Introduction

Yuhao Bi is a notable inventor based in Guangzhou, China. He has made significant contributions to the field of electronic technology, particularly in substrate bonding methods. His innovative approach has led to the development of a unique patent that enhances the efficiency and effectiveness of substrate bonding processes.

Latest Patents

Yuhao Bi holds a patent for a substrate bonding method. This method involves providing a first and a second substrate, forming a first metal micro-bump array on the first substrate, and a second metal micro-bump array on the second substrate. The process includes pressing the two substrates together to create a physically interwoven interlocking structure between the metal nanowires. Additionally, a filling material is applied and cured to form a bonding cavity, followed by confined heating reflux on the micro-bump arrays. This innovative method is designed to improve the reliability and performance of electronic devices.

Career Highlights

Yuhao Bi is currently employed at Shenzhen Xiuyuan Electronic Technology Co., Ltd. His work at this company has allowed him to focus on advancing substrate bonding technologies. His dedication to innovation has positioned him as a key figure in the electronic technology sector.

Collaborations

Yuhao Bi collaborates with talented individuals such as Yunzhi Ling and Siliang He. Their teamwork fosters a creative environment that encourages the development of cutting-edge technologies in the field.

Conclusion

In summary, Yuhao Bi's contributions to substrate bonding technology exemplify his innovative spirit and commitment to advancing electronic technology. His patent and collaborative efforts continue to influence the industry positively.