Company Filing History:
1 out of 544 
1 out of 832,912 Years Active: 2001
Title: Yuh-Ching Su: Innovator in Semiconductor Technology
Introduction
Yuh-Ching Su is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative approach to improving interconnection structures in integrated circuits.
Latest Patents
One of his latest patents is titled "Semiconductor device having structure of copper interconnect/barrier dielectric liner/low-k dielectric trench and its fabrication method." This invention relates to an interconnection structure that utilizes copper interconnects and low-k dielectrics. It incorporates a barrier dielectric liner made of a nitrogen-containing liquid-phase-deposition fluorosilicate glass film, which replaces traditional barrier metal layers and oxide liners.
Another notable patent is "Method of sidewall capping for degradation-free damascene trenches of low dielectric constant dielectric by selective liquid-phase deposition." This invention addresses the degradation issues faced by low dielectric constant materials, such as methylsilsesquioxane, during resist ashing. The innovative sidewall capping technology selectively deposits a high-quality, low-k oxide film onto the sidewalls of methylsilsesquioxane trenches, effectively protecting them from ashing-induced degradation.
Career Highlights
Yuh-Ching Su has worked with the National Science Council, contributing to various research initiatives in semiconductor technology. His work has been instrumental in advancing the understanding and application of low-k dielectrics in integrated circuits.
Collaborations
He has collaborated with notable colleagues, including Ching-Fa Yeh and Yueh-Chuan Lee, who have contributed to his research endeavors and innovations in the semiconductor field.
Conclusion
Yuh-Ching Su's contributions to semiconductor technology through his patents and collaborations highlight his role as an innovator in the industry. His work continues to influence advancements in integrated circuit design and fabrication.