The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 26, 2001

Filed:

Nov. 23, 1999
Applicant:
Inventors:

Ching-Fa Yeh, Hsinchu, TW;

Yueh-Chuan Lee, Hsinchu, TW;

Yuh-Ching Su, Hsinchu, TW;

Kwo-Hau Wu, Hsinchu, TW;

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/176 ;
U.S. Cl.
CPC ...
H01L 2/176 ;
Abstract

A low dielectric constant (k) material, such as methylsilsesquioxane (MSQ), used as an interlevel dielectric is expected to reduce the parasitic capacitance in integrated circuit. However, MSQ film can be easily degraded during resist ashing after the film is etched with the damascene trenches being created. The present invention discloses an innovative sidewall capping technology to solve the degradation issue. Prior to resist ashing, a high-quality, low-k oxide film is selectively deposited onto the sidewalls of MSQ trenches using selective liquid-phase deposition. Experimental results demonstrate that the capping oxide can effectively protect the sidewalls of MSQ trenches from ashing-induced degradation.


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