This inventor holds 2 USPTO granted patents. Top assignee: Peking University. Active years: 2014-2015.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2014-2015
Title: Yufeng Jin: Innovator in Three-Dimensional Interconnected Structures
Introduction
Yufeng Jin is a prominent inventor based in Beijing, China. He has made significant contributions to the field of microelectronics through his innovative patents. With a total of 2 patents, his work focuses on enhancing the electric interconnection and bonding between layers of chips.
Latest Patents
Yufeng Jin's latest patents include a three-dimensional vertically interconnected structure and its associated fabricating method. The first patent discloses a structure comprising at least two layers of chips stacked in sequence or face to face. An adhesive material is utilized for adhesion between adjacent layers, with each layer containing a substrate layer and a dielectric layer. The front surface of the chip features a first concave filled with metal, forming an electrical conductive ring that connects to microelectronic devices via a redistribution layer. This invention enhances electric interconnection and simplifies the fabrication process, ultimately increasing yield. The second patent reiterates the same innovative structure and method, emphasizing the strength of electric interconnection and adhesion between layers while improving the overall yield.
Career Highlights
Yufeng Jin is affiliated with Peking University, where he continues to advance research in microelectronics. His work has garnered attention for its practical applications in the industry, particularly in improving the efficiency of electronic devices.
Collaborations
Yufeng Jin has collaborated with notable colleagues such as Shenglin Ma and Min Miao. Their combined expertise contributes to the innovative research and development efforts at Peking University.
Conclusion
Yufeng Jin's contributions to the field of microelectronics through his patents on three-dimensional interconnected structures demonstrate his commitment to innovation. His work not only enhances the performance of electronic devices but also simplifies manufacturing processes, making a significant impact in the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
