Company Filing History:
Years Active: 2010-2016
Title: Innovations by Yueh Se Ho in Power Device Packaging
Introduction
Yueh Se Ho is a notable inventor based in Sunnyvale, CA, who has made significant contributions to the field of power device packaging. With a total of 7 patents to his name, he has developed innovative methods that enhance the efficiency and reliability of power transistors.
Latest Patents
One of his latest patents is titled "Methods and configuration for manufacturing flip chip contact (FCC) power package." This invention describes a power device package designed to contain, protect, and provide electrical contacts for a power transistor. The package features top and bottom lead frames that allow for direct no-bump attachment to the power transistor. The power transistor is attached to the bottom lead frame as a flip-chip, with source and gate contacts directly no-bumping attaching to the bottom lead frame. Additionally, the power transistor has a bottom drain contact that attaches to the top lead frame. The top lead frame includes an extension that provides a bottom drain electrode on the same side as the bottom lead frame. In a preferred embodiment, the package incorporates a joint layer between the device metal of the source, gate, or drain and the top or bottom lead frame, achieved through the application of ultrasonic energy. Another embodiment includes a layer of conductive epoxy or adhesive, solder paste, carbon paste, or other attachment agents for direct no-bumping attachment of the power transistor to one of the lead frames.
Career Highlights
Yueh Se Ho is currently employed at Alpha & Omega Semiconductor Corporation, where he continues to innovate in the field of semiconductor technology. His work has been instrumental in advancing the design and functionality of power devices.
Collaborations
He collaborates with talented coworkers, including Ming Sun and Kai Chieh Liu, who contribute to the innovative environment at Alpha & Omega Semiconductor Corporation.
Conclusion
Yueh Se Ho's contributions to power device packaging through his patents reflect his commitment to innovation in the semiconductor industry. His work not only enhances the performance of power transistors but also sets a foundation for future advancements in the field.