Yue Kang Lu

Title: Innovations by Yue Kang Lu

Introduction

Yue Kang Lu is a notable inventor based in Singapore, SG. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on addressing critical challenges in semiconductor chip design and manufacturing.

Latest Patents

One of his latest patents is titled "Crack-arresting structure for through-silicon vias." This invention relates to structures formed on semiconductor chips that help mitigate thermally induced stresses and cracking problems associated with through-silicon vias (TSVs). The device includes a substrate and a crack-arresting structure positioned above it, designed to enhance the reliability of semiconductor chips.

Another significant patent is "TSV backside processing using copper damascene interconnect technology." This patent discusses interconnect structures for making electrical connections between semiconductor chips in a stacked or 3D configuration. The method involves forming a conductive via element in a semiconductor substrate and filling a via opening with conductive contact material, thereby improving the efficiency of chip interconnections.

Career Highlights

Yue Kang Lu is currently employed at Globalfoundries Singapore Pte. Ltd., where he continues to innovate in semiconductor technology. His work has been instrumental in advancing the capabilities of semiconductor devices, particularly in enhancing their durability and performance.

Collaborations

He has collaborated with notable colleagues, including Shaoning Yuan and Yeow Kheng Lim, contributing to a dynamic research environment that fosters innovation and development in the semiconductor industry.

Conclusion

Yue Kang Lu's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work not only addresses current challenges but also paves the way for future advancements in semiconductor design and manufacturing.