Beijing, China

Yue-Feng Meng


Average Co-Inventor Count = 7.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2020

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1 patent (USPTO):Explore Patents

Title: The Innovative Journey of Yue-Feng Meng: Pioneering Nanoporous Copper Manufacturing

Introduction: Yue-Feng Meng, an inventive mind based in Beijing, China, has made significant strides in the field of materials science. With one patent to his name, he has contributed to advancements in the production of nanoporous copper, a material with numerous applications in electronics and energy storage.

Latest Patents: Yue-Feng Meng's patent, titled "Method for Making Nanoporous Copper," outlines a novel approach to creating this material. The method involves providing a copper alloy layer and at least one active metal layer to form a structured composite. Through a series of folding and pressing processes, a precursor is developed, which is then treated to produce nanoporous copper. This innovative technique showcases Meng's ability to manipulate materials at the microscopic level for enhanced performance.

Career Highlights: Throughout his career, Yue-Feng Meng has collaborated with esteemed institutions, including Tsinghua University, where he contributed to cutting-edge research and development initiatives. His professional journey also includes a tenure at Hon Hai Precision Industry Co., Ltd., where he further honed his skills in innovation and research.

Collaborations: Yue-Feng Meng has worked closely with colleagues Lun-Qiao Xiong and Yuan-Feng Liu. Their collaborative efforts demonstrate the importance of teamwork in scientific research, driving forward the boundaries of what is possible in material fabrication.

Conclusion: In summary, Yue-Feng Meng's contributions to the field of nanoporous copper manufacturing reflect a deep commitment to innovation and research. His work has the potential to impact various industries, making him a noteworthy figure in contemporary materials science. As his career progresses, the future holds promising opportunities for further breakthroughs and collaborations in this exciting field.

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