The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 2020
Filed:
Sep. 21, 2018
Tsinghua University, Beijing, CN;
Hon Hai Precision Industry Co., Ltd., New Taipei, TW;
Yue-Feng Meng, Beijing, CN;
Lun-Qiao Xiong, Beijing, CN;
Yuan-Feng Liu, Beijing, CN;
Ze-Cheng Hou, Beijing, CN;
Hong-Ying Fu, Beijing, CN;
Lin Zhu, Beijing, CN;
Wen-Zhen Li, Beijing, CN;
Tsinghua University, Beijing, CN;
HON HAI PRECISION INDUSTRY CO., LTD., New Taipei, TW;
Abstract
A method of making a nanoporous copper is provided. A copper alloy layer and at least one active metal layer are provided. The copper alloy layer comprises a first surface and a second surface. The at least one active metal layer is located on the first surface and the second surface to form a structure. The structure is processed to form a composite structure. A process of folding and pressing the composite structure is repeated to form a precursor. The precursor is corroded to form the nanoporous copper.