Yuan-Tsang Liaw

Title: Innovations of Yuan-Tsang Liaw

Introduction

Yuan-Tsang Liaw is a notable inventor based in Taipei Hsien, Taiwan. He has made significant contributions to the field of chip structures, holding a total of 2 patents. His work focuses on enhancing the design and functionality of semiconductor devices.

Latest Patents

Yuan-Tsang Liaw's latest patents include innovative designs that improve chip structures. One of his patents is titled "Chip structure with bevel pad row." This invention features a substrate with an active surface that includes a middle wire bonding area and a corner wire bonding area. The design incorporates a bevel edge with an acute incline angle, allowing for a more efficient arrangement of pads. The bevel pad row consists of multiple bevel pads, exceeding the number of middle pad rows in the middle wire bonding area.

Another significant patent is "Chip structure with arrangement of side pads." This invention presents a substrate that features an arrangement of side pads on its active surface. The design includes an outer pad row, a middle pad row, and an inner pad row, all strategically placed to enhance performance. The staggering of pads between the middle and inner pad rows optimizes the layout for signal transmission.

Career Highlights

Yuan-Tsang Liaw is currently employed at Via Technologies, Inc., where he continues to innovate in the semiconductor industry. His expertise in chip design has positioned him as a valuable asset to his company and the field at large.

Collaborations

Throughout his career, Yuan-Tsang Liaw has collaborated with talented individuals such as Chi-Hsing Hsu and Hung-Wen Shih. These partnerships have contributed to the advancement of technology in their respective projects.

Conclusion

Yuan-Tsang Liaw's contributions to chip structure innovations demonstrate his commitment to advancing technology in the semiconductor industry. His patents reflect a deep understanding of design and functionality, making him a prominent figure in his field.