This inventor holds 1 USPTO granted patent and 7 published patent applications. Top assignee: Siliconware Precision Industries Co., Ltd.. Active years: 2025.
Company Filing History:
Years Active: 2025
Title: Innovations of Yuan-Ping Yeh in Electronic Packaging
Introduction
Yuan-Ping Yeh is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of electronic packaging, particularly through his innovative designs and structures. His work focuses on enhancing the efficiency and reliability of electronic components.
Latest Patents
Yuan-Ping Yeh holds a patent for an "Electronic package and substrate structure thereof." This invention features a substrate structure that includes a circuit layer and a filling layer. The circuit layer is designed with multiple conductive traces that are separated from one another. The filling layer is strategically placed between these conductive traces, and both the circuit layer and the filling layer are covered with an insulating protective layer. This design allows for a thinner insulating protective layer, which helps prevent copper migration in subsequent processes.
Career Highlights
Yuan-Ping Yeh is associated with Siliconware Precision Industries Co., Ltd., where he applies his expertise in electronic packaging. His innovative approach has contributed to advancements in the industry, making electronic devices more efficient and reliable.
Collaborations
Yuan-Ping Yeh has collaborated with notable colleagues such as Yuan-Chang Ni and Yu-Cheng Pai. Their combined efforts in research and development have furthered the field of electronic packaging.
Conclusion
Yuan-Ping Yeh's contributions to electronic packaging through his innovative patent demonstrate his commitment to advancing technology in this field. His work continues to influence the design and functionality of electronic components.