This inventor holds 1 USPTO granted patent. Top assignee: Sandisk Technologies Inc.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Innovations by Yuan Ming in Wire Bonding Technology
Introduction
Yuan Ming is a notable inventor based in Shanghai, China. He has made significant contributions to the field of wire bonding technology. His innovative approach has led to the development of a unique wire bonding machine that enhances the efficiency and effectiveness of bond wire connections.
Latest Patents
Yuan Ming holds a patent for a "Wire bonding machine having a rotatable capillary to secure a bond wire to a connection point." This invention features a wire bonder equipped with a rotatable capillary that forms a stitch bond on the bonding surface of a connection point. The rotation of the capillary in an XY plane allows for optimal contact between the stitch bond and the connection point, ensuring a robust and reliable bond.
Career Highlights
Yuan Ming is currently employed at Sandisk Technologies Inc., where he continues to innovate and develop advanced technologies in the field. His work has garnered attention for its practical applications and contributions to the industry.
Collaborations
Yuan Ming collaborates with talented coworkers, including Jingyun Chen and Fen Yu. Their combined expertise fosters a creative environment that drives innovation and enhances project outcomes.
Conclusion
Yuan Ming's contributions to wire bonding technology exemplify the spirit of innovation. His patent and work at Sandisk Technologies Inc. highlight his commitment to advancing the field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile