The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2026
Filed:
Jan. 11, 2024
Sandisk Technologies, Inc., Milpitas, CA (US);
Jingyun Chen, Shanghai, CN;
Fen Yu, Shanghai, CN;
Guangqiang Li, Shanghai, CN;
Pengchen AI, Shanghai, CN;
Fuqiang Xiao, Shanghai, CN;
Shujun Zheng, Shanghai, CN;
Yuan Ming, Shanghai, CN;
Sizhe Yue, Shanghai, CN;
Lian Chen, Shanghai, CN;
Sandisk Technologies, Inc., Milpitas, CA (US);
Abstract
A wire bonder has a rotatable capillary for forming a stitch bond on a bonding surface of a connection point. When the stitch bond is formed, a bond head of the wire bonder causes the capillary to rotate in a XY plane. Rotation of the capillary causes at least a portion of the stitch bond to contact one or more side walls of the connection point. As a result, an entire surface area of the stitch bond contacts one or more surfaces of the connection point.