Yuan Jing Li

Title: Innovations by Yuan Jing Li in Semiconductor Packaging

Introduction

Yuan Jing Li is a notable inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor packaging, particularly through his innovative methods. His work is recognized for enhancing the efficiency and effectiveness of electronic components.

Latest Patents

Yuan Jing Li holds a patent for a "Method of manufacturing stacked wafer level package." This patent outlines a comprehensive process that includes preparing a substrate, forming a conductive layer, and creating chip connection pads. The method also details the steps for mounting a semiconductor chip, sealing it, and forming external connections. This innovation is crucial for improving the performance and reliability of electronic devices.

Career Highlights

Yuan Jing Li is currently employed at Samsung Electro-Mechanics Co., Ltd., a leading company in the electronics industry. His role involves developing advanced packaging solutions that are essential for modern electronic applications. His expertise in semiconductor technology has positioned him as a key player in his field.

Collaborations

Yuan Jing Li has collaborated with several talented individuals, including Seung Wook Park and Young Do Kweon. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Yuan Jing Li's contributions to semiconductor packaging through his patented methods demonstrate his commitment to advancing technology in the electronics sector. His work continues to influence the industry and pave the way for future innovations.