Company Filing History:
Years Active: 2025
Title: Innovations of Yuan-Jen Lee
Introduction
Yuan-Jen Lee is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of memory technology, particularly in magnetoresistive random access memory (MRAM) devices. With a total of 3 patents to his name, his work continues to influence advancements in semiconductor technology.
Latest Patents
One of his latest patents is focused on external magnetic field detection for MRAM devices. This invention provides a mechanism for the MRAM device to assess the strength of an external magnetic field and determine if it poses a risk to the integrity of the stored memory data. The device includes a main magnetic tunnel junction (MTJ) array and a reference MTJ array, along with a controller that evaluates the gross resistance of the reference MTJ array. If the external magnetic field is deemed fatal, the controller notifies users that the memory data may be untrustworthy.
Another significant patent by Yuan-Jen Lee involves a wafer bonding method and bonded device structure. This method outlines a process for aligning two wafers using both optical and magnetic alignment techniques. The innovative approach ensures that the magnetic features of the wafers are properly aligned before forming bonds, enhancing the reliability of the bonded device structure.
Career Highlights
Yuan-Jen Lee is currently employed at Taiwan Semiconductor Manufacturing Company Limited, where he applies his expertise in semiconductor technology. His work has been instrumental in developing advanced memory solutions that cater to the growing demands of modern electronics.
Collaborations
He has collaborated with notable colleagues such as Tien-Wei Chiang and Harry-hak-lay Chuang, contributing to a dynamic research environment that fosters innovation and technological advancement.
Conclusion
Yuan-Jen Lee's contributions to the field of memory technology through his patents and collaborations highlight his role as a key innovator in the semiconductor industry. His work continues to pave the way for future advancements in MRAM devices and wafer bonding techniques.