Yuan-Fu Sung

Title: **Inventor Spotlight: Yuan-Fu Sung**

Introduction

Yuan-Fu Sung is a prominent inventor based in Kaohsiung, Taiwan. With a knack for innovation in the field of semiconductor technology, he holds two patents that demonstrate his expertise and forward-thinking approach to design and manufacturing in the semiconductor industry.

Latest Patents

Yuan-Fu Sung's latest contributions include two significant patents related to semiconductor packages. The first patent outlines a method of manufacturing a semiconductor package, which involves several steps: providing a first passivation layer on a carrier, patterning the first passivation layer to define a first hole, disposing of a first seed layer on the first hole, and applying a first conductive layer on the first seed layer. The method continues by replacing the carrier with a second passivation layer and patterning it to define a second hole, ultimately allowing for the disposal of a second conductive layer on the exposed first seed layer through this second hole.

The second patent describes a semiconductor package containing a unique passivation layer with a defined through hole extending from one surface to the other. This package features a first conductive layer on the first surface and sidewall, a second conductive layer on the opposite surface and sidewall, and a third conductive layer situated between the first and second conductive layers, enhancing the functionality and efficiency of the semiconductor package.

Career Highlights

Yuan-Fu Sung is associated with Advanced Semiconductor Engineering, Inc., a leading player in the semiconductor industry, where he contributes his knowledge and skills to drive advancements in semiconductor package design and manufacturing processes. His work is vital to the continual improvement and innovation in this fast-evolving field.

Collaborations

Throughout his career, Yuan-Fu has collaborated with skilled professionals such as Shin-Hua Chao and Ming-Chi Liu. These collaborations bring together diverse expertise and insights that fuel creative thinking and result in groundbreaking innovations in semiconductor technology.

Conclusion

With his two innovative patents and contributions to Advanced Semiconductor Engineering, Inc., Yuan-Fu Sung exemplifies the spirit of innovation in the semiconductor industry. His work not only showcases his talent as an inventor but also underscores the importance of collaboration and continuous improvement in technology development. The impact of his inventions continues to shape the future of semiconductor packages and enhance the performance of electronic devices.