Yu-Yuan Huang

Title: Yu-Yuan Huang: Innovator in Semiconductor Technology

Introduction

Yu-Yuan Huang is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique semiconductor device package structure.

Latest Patents

Yu-Yuan Huang holds a patent for a semiconductor device package structure and method for fabricating the same. This patent describes a semiconductor device package structure that includes a substrate with a circuit structure formed in a die region. The die region is defined by a plurality of scribe lines configured on the substrate. A seal ring is disposed in the substrate and located at the periphery region of the die region, surrounding at least a portion of the circuit structure. Additionally, a trench ring is positioned in the substrate between the seal ring and the scribe lines. A packaging passivation cap layer covers the circuit structure and the seal ring, as well as at least the trench ring. This innovative design enhances the reliability and performance of semiconductor devices.

Career Highlights

Yu-Yuan Huang is associated with United Microelectronics Corporation, a leading company in the semiconductor industry. His work at this organization has allowed him to contribute to cutting-edge technologies and advancements in semiconductor packaging.

Collaborations

Throughout his career, Yu-Yuan Huang has collaborated with notable colleagues, including Kai-Kuang Ho and Tsung-Kai Yu. These collaborations have fostered innovation and have been instrumental in the development of new technologies in the semiconductor field.

Conclusion

Yu-Yuan Huang's contributions to semiconductor technology, particularly through his patented innovations, highlight his role as a key inventor in the industry. His work continues to influence advancements in semiconductor packaging and device reliability.