Yu-wen Li

Title: Yu-wen Li and a Chip Packaging Invention.

Introduction

Yu-wen Li is an inventor associated with Taoyuan, Taiwan, and Tong Hsing Electronic Industries, Ltd. The information provided credits Li with 1 patent, concerning a chip package structure and a method for producing it.

Latest Patents

Li’s patent, “Chip Package Structure and Method for Producing the Same,” describes a process for assembling and sealing a chip package. The method places a chip upside down on a substrate and connects the chip to the substrate with bonding wires. A reflecting member is positioned on the substrate, and a support body is formed over it. A package cover is then attached to the support body with glass adhesive.

To solidify the adhesive, a light beam is directed at the reflecting member, which reflects the beam toward the adhesive. The process concludes by forming a package body over an edge of the package cover and the top part of the support body. This approach uses reflected light to support the adhesive-curing step in the packaging process.

Career Highlights

The supplied information associates Li with Tong Hsing Electronic Industries, Ltd., and identifies the chip packaging patent as his recorded invention. The patent focuses on package assembly, cover attachment, and adhesive solidification.

Collaborations

Li’s named coworker is Li-chun Hung, who is identified in the supplied information as a woman. No further details about their collaboration or respective contributions are provided.

Conclusion

Yu-wen Li’s patent documents a chip packaging method that uses a reflecting member to direct curing light toward glass adhesive, highlighting a specific manufacturing approach associated with his work at Tong Hsing Electronic Industries, Ltd.