IDiyas

For the Inventor, By the Inventor

Taipei, Taiwan

Yu-Wei Chiu

USPTO Granted Patents = 15

Average Co-Inventor Count = 2.5

ph-index = 2

Forward Citations = 9(Granted Patents)


Company Filing History:

goldMedal8 out of 2,459 
 
Wistron Corporation
 patents
silverMedal7 out of 33 
 
Amulaire Thermal Technology, Inc.
 patents

Years Active: 2016-2025

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15 patents (USPTO):Explore Patents
1. 12477695 - Two-phase immersion-cooling heat-dissipation structure having skived fins (2025-11-18),
2. 12432883 - Two-phase immersion-type heat dissipation structure having acute-angle notched structures (2025-09-30),
3. 12396131 - Two-phase immersion-cooling heat-dissipation structure having shortened evacuation route for vapor bubbles (2025-08-19),
4. 12289865 - Two-phase immersion-cooling heat-dissipation composite structure having high-porosity solid structure and high-thermal-conductivity fins (2025-04-29),
5. 12262511 - Two-phase immersion-type heat dissipation device having reinforced fins (2025-03-25),
6. 12207445 - Two-phase immersion-type composite heat dissipation device (2025-01-21),
7. 12108574 - Two-phase immersion-type heat dissipation structure having fins for facilitating bubble generation (2024-10-01),
8. 9869970 - Hologram module, display device having the same and wearing device having the same (2018-01-16),
9. 9791610 - Backlight module and display having the same (2017-10-17),
10. 9775264 - Display device and wall mount module thereof (2017-09-26),
11. 9744756 - Method, apparatus and computer readable medium for producing prototype diagram of three dimensional object (2017-08-29),
12. 9507078 - Black light module with mount and displaying apparatus therewith (2016-11-29),
13. 9424769 - Display and brightness adjusting method thereof (2016-08-23),
14. 9423557 - Backlight component (2016-08-23),
15. 9326148 - Display apparatus and authorizing method thereof (2016-04-26),

Title: Innovations of Yu-Wei Chiu in Heat Dissipation Technology

Introduction

Yu-Wei Chiu is a prominent inventor based in New Taipei, Taiwan, known for his significant contributions to heat dissipation technology. With a total of 14 patents to his name, he has developed innovative solutions that enhance the efficiency of thermal management systems.

Latest Patents

Among his latest patents, Yu-Wei Chiu has introduced a two-phase immersion-type heat dissipation structure featuring acute-angle notched structures. This design includes a heat dissipation substrate with a fin surface and a non-fin surface, where the non-fin surface is in contact with a heat source immersed in a two-phase coolant. The structure is designed to optimize heat transfer, with more than half of the fins being functional fins, each having specific angles to maximize efficiency.

Another notable patent is the two-phase immersion-cooling heat-dissipation structure that incorporates a shortened evacuation route for vapor bubbles. This innovation features an immersion-cooling substrate with fins that enhance the cooling process by facilitating the efficient evacuation of vapor bubbles, thereby improving overall thermal performance.

Career Highlights

Yu-Wei Chiu has worked with notable companies such as Wistron Corporation and Amulaire Thermal Technology, Inc. His experience in these organizations has allowed him to refine his expertise in thermal management technologies and contribute to advancements in the field.

Collaborations

Throughout his career, Yu-Wei Chiu has collaborated with talented individuals, including Chun-Te Wu and Ching-Ming Yang. These partnerships have fostered a creative environment that has led to the development of innovative solutions in heat dissipation.

Conclusion

Yu-Wei Chiu's work in heat dissipation technology exemplifies the impact of innovative thinking in engineering. His patents reflect a commitment to enhancing thermal management systems, making significant strides in the industry.

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