Yu Tokuda is a prominent inventor based in Muko, Japan. He has made significant contributions to the field of electronic components, holding a total of 5 patents. His work focuses on improving the performance and cost-effectiveness of electronic materials.

Latest Patents

Among his latest patents is an innovative electronic component featuring a tin alloy plating film. This component includes a body, a metal film formed on the body, and a tin alloy plating film that contains Sn and at least one additive metal selected from Bi, Ni, Ag, Zn, and Co. Another notable patent is for a soldered article that comprises a component with a Cu conductor joined with a solder. This solder contains about 0.1 to 2.0% by weight of Cu, about 1.0 to 7.5% by weight of Bi, with the balance being Sn. The use of this lead-free solder suppresses leaching during soldering, enhances solderability, and improves joining strength while reducing material costs.

Career Highlights

Yu Tokuda is currently employed at Murata Manufacturing Co., Ltd., a leading company in the electronics industry. His work has been instrumental in advancing the technology behind electronic components, making them more efficient and cost-effective.

Collaborations

He has collaborated with notable coworkers, including Kunihiko Hamada and Kiyoshi Hase, contributing to various projects that enhance the capabilities of electronic materials.

Conclusion

Yu Tokuda's innovative work in electronic components has led to significant advancements in the field. His patents reflect a commitment to improving technology while reducing costs, making a lasting impact on the industry.

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