Murata Manufacturing Co., Ltd.

Yu Tokuda

Akira Ando

Hiroshi Takagi

Koichi Hayashi

Kunihiko Hamada

Akira Nagai

Kiyoshi Hase

Hidekiyo Takaoka

Tatsuo Kunishi

Masanori Endo

Yukiko Fujii

An electronic component has a body; a metal film formed on the body; and a tin alloy plating film formed on the metal film. The tin alloy plating film contains Sn and at least one additive metal selected from the group consisting of Bi, Ni, Ag, Zn and Co.

Electronic component having a tin alloy plating film

There is provided a soldered article comprising a component having a Cu conductor joined with a solder, wherein the solder comprises about 0.1 to 2.0% by weight of Cu, about 1.0 to 7.5% by weight of Bi, and the balance being Sn. By using the above described lead-free solder, the occurrence of leaching is suppressed during soldering, and the solderability and joining strength can be improved. Since the solder does not contain Ag, material cost can be reduced, thus enabling reductions in the cost of the entire soldered article.

Soldered article

There is provided a piezoelectric ceramic having a small mechanical factor of merit Qm and excellent heat-resisting properties, e.g., a piezoelectric ceramic for filter elements which is compatible with surface mounting and a method of manufacturing the same in a large amount and in a stable manner. There is provided a piezoelectric ceramic which is a composite oxide of at least lead, zirconium and titanium, wherein an oxide of manganese exists in a grain boundary layer in a density higher than that in a crystal grain of the piezoelectric ceramic and a glass phase exists in the grain boundary layer. It is manufactured by depositing a manganese compound and a glass material on the surface of a piezoelectric ceramic comprising a composite oxide of at least lead, zirconium and titanium and by performing thermal processing thereafter to diffuse the deposited substance in a grain boundary portion of the piezoelectric ceramic.

Piezoelectric ceramic and manufacturing method thereof

Piezoelectric ceramics whose mechanical quality factor Qm is small and which has an excellent heat resistance, e.g. piezoelectric ceramics for filtering elements whose group delay time characteristic is flat, phase distortion is small and which can be accommodated to surface mounting, and a method for stably producing it are provided. Manganese oxide and lead oxide are caused to coexist in high concentration in grain boundary parts of the piezoelectric ceramics containing composite oxides of at least lead, zirconium and titanium as compared to intra-crystal grains of the piezoelectric ceramics. It is manufactured by treating the piezoelectric ceramics by heat after adhering manganese and lead compounds on the surface thereof to diffuse the oxides in the grain boundary parts of the piezoelectric ceramics.

Piezoelectric ceramics and manufacturing method thereof

A conductive paste contains at least a conductive powder and a glass frit. The glass frit includes 9.0 to 45.0 wt % of SiO.sub.2 and 1.0 to 18.5 wt % of CaO, the balance being ZnO, B.sub.2 O.sub.3 and Li.sub.2 O. The glass frit may contain not more than 6.0 wt % of Al.sub.2 O.sub.3 incorporated therein as additive.

Growing community of inventors

Muko, Japan

Yu Tokuda