Yu-Ting Wang

Title: Innovations of Yu-Ting Wang

Introduction

Yu-Ting Wang is a notable inventor based in Milpitas, CA (US). He has made significant contributions to the field of semiconductor technology. His innovative work focuses on wafer-bonding structures, which are essential in the manufacturing of advanced electronic devices.

Latest Patents

Yu-Ting Wang holds a patent for a "Wafer-bonding structure and method of forming thereof." This patent describes a method that includes a wafer-bonding step, a through silicon via (TSV) forming step, and a forming bonding pad step. In the wafer-bonding step, at least two wafers are bonded to each other by their bonding surfaces. The TSV forming step involves creating a TSV structure on one side of a seal ring structure of one of the wafers, where a conductive filler is placed in the TSV structure. This structure overlaps with the seal ring structure of another wafer. Finally, in the forming bonding pad step, a bonding pad is created on the outer surface relative to the bonding surface of the wafer with the TSV structure, culminating in the formation of the wafer-bonding structure. He has 1 patent to his name.

Career Highlights

Yu-Ting Wang is currently employed at Integrated Silicon Solution Incorporated, where he continues to push the boundaries of semiconductor technology. His work has been instrumental in developing methods that enhance the efficiency and performance of electronic components.

Collaborations

Yu-Ting Wang collaborates with talented individuals in his field, including Hsingya Arthur Wang and Sheng-Yuan Chou. These collaborations foster innovation and contribute to the advancement of technology in the semiconductor industry.

Conclusion

Yu-Ting Wang's contributions to wafer-bonding technology exemplify the spirit of innovation in the semiconductor field. His patent and ongoing work at Integrated Silicon Solution Incorporated highlight his commitment to advancing technology.