Taichung, Taiwan

Yu-Sheng Lee

This inventor holds 1 USPTO granted patent. Top assignee: Rexchip Electronics Corporation. Active years: 2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yu-Sheng Lee. Retrieved from https://idiyas.com/inventor/yu-sheng-lee-xv9pos8x

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2013

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1 patent (USPTO):Explore Patents

Title: Innovations by Yu-Sheng Lee

Introduction

Yu-Sheng Lee is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of robotics, particularly in the development of technology for wafer handling.

Latest Patents

Yu-Sheng Lee holds a patent for a "Robot arm for delivering a wafer and wafer-operating machine." This innovative robot arm comprises a carrier plate, an inner ring, a driving device, and at least one contact pad. The inner ring is positioned on the carrier plate and defines at least one through-hole. The driving device is connected to the carrier plate, allowing for movement. The contact pad, located at the through-hole of the inner ring, features a first protrusion portion and a second protrusion portion. The first protrusion portion extends from the inner ring's surface to ensure that the wafer does not come into contact with it. The second protrusion portion is secured within the through-hole, effectively fixing the contact pad to the inner ring. This invention enhances the efficiency and precision of wafer handling in various applications.

Career Highlights

Yu-Sheng Lee is currently employed at Rexchip Electronics Corporation, where he continues to innovate and contribute to advancements in technology. His work focuses on improving processes related to semiconductor manufacturing and robotics.

Conclusion

Yu-Sheng Lee's contributions to the field of robotics and wafer handling demonstrate his commitment to innovation and technology. His patent reflects a significant advancement in the efficiency of wafer operations, showcasing his expertise and dedication to the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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