The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2013

Filed:

Nov. 18, 2010
Applicant:

Yu-sheng Lee, Taichung County, TW;

Inventor:

Yu-Sheng Lee, Taichung County, TW;

Assignee:

Rexchip Electronics Corporation, Houli Township, Taichung County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B66F 19/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A robot arm for delivering a wafer is disclosed which comprises a carrier plate, an inner ring, a driving device and at least a contact pad. The inner ring is disposed on the carrier plate and defines at least a through-hole. The driving device is connected to the carrier plate to move the carrier plate. The contact pad is disposed at the through-hole of the inner ring and comprises a first protrusion portion and a second protrusion portion. The first protrusion portion protrudes from a first surface of the inner ring and is used for being in contact with the wafer to prevent it from being in contact with the first surface. The second protrusion portion is lodged in the through-hole to fix the contact pad at the inner ring.


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