Yu-Min Cheng

Title: Yu-Min Cheng: Innovator in Semiconductor Technology

Introduction

Yu-Min Cheng is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding two patents that showcase his innovative approach to manufacturing.

Latest Patents

One of Yu-Min Cheng's latest patents is focused on a semiconductor package and the method of manufacturing the same. This semiconductor package includes a substrate, a semiconductor die, a ring structure, and a lid. The semiconductor die is positioned on the substrate, while the ring structure surrounds the semiconductor die. Notably, the first side of the semiconductor die is separated from the inner sidewall of the ring structure by a first gap, and the second side is separated by a second gap. The first gap is less than the second gap, and the lid is placed on the ring structure, featuring a recess that overlaps with the first gap in the stacking direction of the ring structure and the lid.

Career Highlights

Yu-Min Cheng is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work has been instrumental in advancing semiconductor packaging technologies, which are crucial for the performance and reliability of electronic devices.

Collaborations

Some of his notable coworkers include Kai-Ming Ching and Shu-Shen Yeh, who have collaborated with him on various projects within the semiconductor field.

Conclusion

Yu-Min Cheng's contributions to semiconductor technology through his patents and work at Taiwan Semiconductor Manufacturing Company Limited highlight his role as an influential inventor in the industry. His innovative designs continue to shape the future of semiconductor manufacturing.