Tainan, Taiwan

Yu-Min Chen

This inventor holds 1 USPTO granted patent. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yu-Min Chen. Retrieved from https://idiyas.com/inventor/yu-min-chen-fg6txaqe

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2021

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1 patent (USPTO):Explore Patents

Title: Innovations of Yu-Min Chen in CMP Technology

Introduction

Yu-Min Chen is a notable inventor based in Tainan, Taiwan. He has made significant contributions to the field of chemical mechanical polishing (CMP) technology. His innovative approach has led to advancements in estimating film thickness during CMP operations.

Latest Patents

Yu-Min Chen holds a patent for a "CMP apparatus and method for estimating film thickness." This method involves several operations, including placing a substrate with a film over a polishing pad with a slurry in between. During the CMP operation, an in-situ electrochemical impedance spectroscopy (EIS) measurement is conducted to estimate the film thickness in real-time. The CMP process concludes when the estimated thickness reaches a predetermined target.

Career Highlights

Yu-Min Chen is currently employed at Taiwan Semiconductor Manufacturing Company Ltd. His work focuses on enhancing the efficiency and accuracy of CMP processes, which are critical in semiconductor manufacturing. His innovative methods have the potential to improve production quality and reduce costs.

Collaborations

Yu-Min Chen has collaborated with colleagues such as Chin-Wei Liang and Sheng-Chau Chen. Their teamwork has contributed to the development of advanced CMP technologies.

Conclusion

Yu-Min Chen's contributions to CMP technology demonstrate his expertise and innovative spirit in the semiconductor industry. His patent for estimating film thickness showcases the importance of real-time measurements in enhancing manufacturing processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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